Refurbished Combinational Deposition System
The system proposed herein is a Combination Deposition System that includes Electron Beam Evaporation, Thermal Evaporation with Ion Beam Assisted Deposition sources. The chamber can accommodate up to 4”/6” diameter substrates and allows a combination of Thermal Evaporation and Electron Beam techniques to be performed without breaking vacuum. The pumping system includes Cryo based pump roughed by a Dual stage rotary pump.
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Process Chamber
- A highly polished stainless steel box type chamber (22”x22”x24”), with D shaped door.
- Two 4” view ports on the front door
- Additional spare flanges for future upgrades, including future upgrade for Loadlock Assembly.
Vacuum System
- 1500 l/s Cryo Pump
- Dual stage rotary roughing pump
- A gate valve with a separate manual throttle control orifice
- A full range cold cathode - Pirani combination gauge for pressure measurement
E-Beam Source
- 4 pocket, E-Beam source with water cooled crucible, 4cc capacity
- Auto Pocket Indexer for individual pocket selection
- Source shutter
High Voltage Power Supply with X-Y Sweep Controller
- 3kW high voltage DC power supply, (6kV, 500mA max)
- X-Y sweep controller
Thermal Evaporator Power Supply
- Variable, 2kw low voltage power supply (x3)
- Thermal source (x3)
- Source shutter (x3)
Ion Beam Assisted Deposition
- Veeco’s divergent beam Ion source & Power supply
Substrate Stage with Rotation & Heating
- 6” diameter sample stage holder
- Spring clips for holding samples
- Substrate rotation (0-20 rpm)
- IR quartz lamps substrate heating of up to 400°C
FTM 2000 Quartz Crystal Thickness Sensor
- Water cooled quartz crystal thickness sensor
- Cable oscillator